Particles in Solutions and Suspensions

Sizing of a Tri-Modal Polishing Slurry

Sizing of a Tri-Modal Polishing Slurry. Relevant Publication

CT Associates, Inc. has developed a new analytical method, a liquid nanoparticle sizer, for determining the size distribution of nanoparticles in chemical-mechanical planarization (CMP) slurry, solutions or colloidal suspensions.

This method has the unique capability of measuring number concentration for particle sizes ranging from 5 to 1000 nanometers. In addition, this method has the ability to readily distinguish multimodal particle size distributions.

The Change in the Working Particle Size Distribtion For a Silica Slurry with Handling

The Change in the Working Particle Size Distribtion For a Silica Slurry with Handling.

Additional methods used for measuring particle size distribution include dynamic light scattering and light scattering/ extinction techniques. Light scattering/extinction techniques offer the ability to characterize the large particle tail (>0.56 micron).

The Change in the Large Particle Tail of a Silica Slurry With Handling

The Change in the Large Particle Tail of a Silica Slurry With Handling.

By combining techniques we can characterize changes to the large particle tail and working particle size distribution with slurry use. Using these techniques the effect of system components, such as valves and pumps, on slurry particle size distribution can be determined. Our capability for characterizing particle mixtures can be applied to other systems, such as nanoparticle suspensions and emulsions. In addition to measuring overall physical characteristics, particles populations can be captured and their composition determined.